LH612 is one of the LIGHT series infrared thermal camera cores developed by XINGHE. It adopts state-of-the-art 12μm VOx microbolometer technology and integrates 640×512 wafer level package (WLP) infrared thermal detector, high performance signal processing circuit and image processing algorithm.
The LH612 infrared camera module features in precise visualization, sharp and crisp image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
LH612 thermal imaging module has light weight, compact size, low power consumption and provides multiple interface options. It supports DVP/LVDS multi-mode image output interfaces, RAW/YUV image data output and serial port control. Thanks to its fully optimized structure, low power consumption and various standard interfaces, LH612 infrared camera module can provide customers with some standard configurations and enables easy integration into numerous infrared products, such as thermal imagers and infrared thermographic cameras.
Its lightweight and flexible features with various industry standard interfaces make it beneficial to OEM customers for secondary development and integration in all kinds of infrared thermal cameras. Also some customized OEM solutions are available to meet the requirements of customers. It is easily integrate into many kinds of devices like unmanned aerial vehicles (UAV), drones, as well as police and firefighting units.
Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for LH series to be integrated into more terminal products and greatly reduces the cost for customers.
Main Features:
Optimal SWaP
Mini size: 25.4mmx25.4mmx14.1mm
Light Weight: as low as 11.5g
Power consumption: as low as 0.8W
Outstanding Image Quality
New generation image processing algorithm: NUC/3DNR/DNS/DRC/EE
Temperature measurement range: -20℃~150℃, 0~550℃ (support expansion & customization)
Fast Integration
USB2.0/DVP/LVDS image output interfaces, RAW/YUV image data output, serial port control
Provide ARM/windows/Linux SDK; achieve full screen temperature measurement
Specifications:
Model | LH612/R |
IR Detector Performance | |
Sensitive Material | Vanadium Oxide |
Resolution | 640×512 |
Pixel Size | 12μm |
Spectral Range | 8μm~14μm |
Typical NETD | ≤40mK |
Image Processing | |
Frame Rate | 25Hz/30Hz |
Start-up Time | 5s |
Analog Video | PAL/NTSC |
Digital Video | RAW/YUV/BT656 |
Image Algorithm | Non-uniformity Correction (NUC) 3D Noise Reduction (3DNR) 2D Noise Reduction (DNS) Dynamic Range Compression (DRC) Edge Enhancement (EE) |
Image Display | Black Hot/White Hot/Pseudo Color |
PC Software | |
ICC Software | Module Control & Video Display |
Electrical Specifications | |
Standard External Interface | 50Pin_HRS: DF40C-50DP-0.4V(51), (HRS, Male) |
USB Expansion Board | Type-C |
Communication Interface | TTL-232/USB2.0 |
Digital Video Interface | CMOS8/CMOS16/LVDS/USB2.0 |
Supply Voltage | 4~5.5V |
Typical Power Consumption | 0.8W |
Temperature Measurement | |
Operating Temperature Range | -10℃~+50℃ |
Temperature Measurement Range | -20℃~150℃, 0℃~550℃ (Support Expansion & Customization) |
Temperature Measurement Accuracy | Greater of ±3℃ or ±3% |
Regional Temperature Measurement | Support Maximum, Minimum and Average Value of the Output Regional Temperature |
SDK | Windows/Linux/ARM; Achieve Video Stream Analysis and Conversion from Gray to Temperature |
Physical Characteristics | |
Size (mm) | 25.4×25.4×14.1 (Without Lens) |
Weight | 11.5g (Without Lens) |
Environmental Adaptability | |
Operating Temperature | -40°C~+70°C |
Storage Temperature | -45°C~+85°C |
Humidity | 5%~95%, non-condensing |
Vibration | 5.35grms, 3 Axis |
Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
Certificate | ROHS2.0/REACH |
Optics | |
Optional Lens | Fixed Focus Athermal: 4.9mm/9.1mm/13mm/19mm/25mm/35mm/50mm/70mm |
Protection Level | IP67 Rating (Front Lens) |
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